Stamping Back Surface Polishing Device
Can be processed under suitable conditions! Even beginners can operate it easily.
The "Stamping Back Surface Polishing Device" can polish the back surface of a stamper using a wrapping film. The clamping (fixing) and unclamping (removal) of the workpiece is performed by the operator, while roll polishing, pad polishing, brush cleaning, and air blowing are done automatically. Various surface roughness requirements from different companies can be accommodated by selecting the appropriate wrapping tape and adjusting the parameters of the device to enable processing under optimal conditions. 【Features】 ■ It is possible to randomize the circumference of roll polishing with pad polishing. ■ Once the conditions are set, even beginners can operate it easily. *For more details, please refer to the PDF materials or feel free to contact us.
basic information
【Standard Specifications (Excerpt)】 ■Control ・Equipment: Sequencer ・Operation Panel: Color Touch Panel ■Power Supply: 200V 3-phase ■Air: Dry Air = 0.5MPa ■Equipment Dimensions: 1400W * 800D * 1750H (mm) ■Equipment Weight: Approximately 1200kg *For more details, please refer to the PDF document or feel free to contact us.
Price range
Delivery Time
Applications/Examples of results
【Applications】 ■ Back surface polishing of stampers ■ Top surface polishing of ceramic tables ■ Flat surface polishing of disc thin plates, etc. *For more details, please refer to the PDF document or feel free to contact us.
