Thin Plate Surface Grinding Device
A polishing device effective for polishing various substrates and removing fine burrs from punched parts!
The "Thin Plate Flat Grinding Device" performs flat grinding using a lapping film (grinding tape). The workpiece can be attached and detached by the operator, and it can automatically grind the specified area. It is effective for grinding various substrates and for removing fine burrs from punched parts. 【Features】 ■ Film width can be selected based on the workpiece (supports two types) ■ Achieves high efficiency and low-cost processing ■ Effective for grinding various substrates and for removing fine burrs from punched parts ■ If a sub-table is provided, external setup can be done during processing time *For more details, please refer to the PDF materials or feel free to contact us.
basic information
【Standard Specifications】 ■ Tape Specifications ・Tape Width: 110mm・76.2mm (supports 2 types) ・Core Inner Diameter / Winding Direction: 3-inch core, inward winding specification ・Maximum Tape Winding Diameter: Approximately 150m with 3MIL wrapping film ■ Tape Unit Vertical Slide: Servo motor driven ■ Table Horizontal Slide: Servo motor driven, selectable for pitch feeding and continuous feeding ■ Power Supply: 200V 3-phase ■ Air: 0.4–0.5MPa ■ Equipment Dimensions: 1540W * 1190D * 1650H (mm) ■ Weight: Approximately 600kg * For more details, please refer to the PDF document or feel free to contact us.
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Applications/Examples of results
【Applications】 ■ Electroformed plate flat grinding ■ SUS plate flat grinding ■ Glass flat grinding ■ Copper foil flat grinding ■ Resin flat grinding ■ Other thin plate grinding *For more details, please refer to the PDF document or feel free to contact us.
