Full Surface Grinding (Z-axis Control)
A Z-axis is provided, employing a mechanism that does not damage the workpiece! Polishing can be done with a soft touch.
This product is a device for polishing the upper surface of ribbed substrates. Until now, tape backup was performed using the pressing force of rollers, but we have introduced a Z-axis and adopted a mechanism that does not damage the workpiece. Polishing is done using a dry method. The workpiece is attached and detached by the operator, and the predetermined cycle is performed automatically in a semi-automatic machine. 【Features】 ■ Capable of Z-axis control, preventing damage to the initial polishing area ■ Adoption of a flat pad avoids concentrated loads, allowing for soft-touch polishing ■ Once set up, anyone can easily use it *For more details, please refer to the PDF document or feel free to contact us.
basic information
【Standard Specifications】 ■ Table Dimensions: 550mm * 600mm * 80mm (thickness) ■ Tape Specifications ・ Tape Width = 520mm ・ Maximum Roll Length = 50m ・ Core = 3 inches ■ Grinding Reciprocal Speed (Table): Maximum Speed = 240mm/second ■ Control Device ・ Control Equipment: Sequencer ・ Operation Panel: Touch Panel ■ Power Supply: 200V 3-phase ■ Air: Dry Air = 0.4MPa ■ Equipment Dimensions: 2200W * 1100D * 1900H (mm) ■ Weight: Approximately 2000kg * For more details, please refer to the PDF document or feel free to contact us.
Price range
Delivery Time
Applications/Examples of results
【Applications】 ■ Flat polishing of rib substrates ■ Polishing of protruding filling resin ■ Removal of excess resin and leveling of surface resin ■ Removal of metal oxide films, pastes, plating residues, and burrs ■ Pre-treatment polishing before plating/laminating/resist coating ■ Flat polishing of carbon resin *For more details, please refer to the PDF document or feel free to contact us.
