Cooling module CooliBlade for power electronics
![Light guide [liquid / bundle fiber]](https://image.mono.ipros.com/public/premium/image_category/d58/65067/IPROS53721546032777621267.jpeg?w=140&h=140){kind=small}
High-efficiency cooling technology: An optimal cooling solution for thermal management of high-power electronic devices.
This is a cooling module developed for power electronics using CooliBlade's proprietary NEOcore technology. It offers a more efficient and cost-effective thermal management solution compared to traditional aluminum heat sinks and heat pipes. It provides effective cooling solutions for power electronics products such as IGBT, SiC power semiconductors, AC drives, industrial control devices, electric vehicle charging, and smart grids. <Features of NEOcore Technology> - High efficiency with excellent thermal conductivity. - Lightweight: Achieves weight reduction with less raw material compared to other heat sinks (approximately 50% lighter compared to aluminum). - Easy integration into various power electronics products. - Excellent mass production capability (suitable for OEM and mass-produced heat sink modules). If you are struggling with heat dissipation design and thermal management for high-power electronic devices, please contact us.
basic information
Product Model ■AURORA (Forced Air Cooling) Cooling modules for power modules, IGBT power semiconductors, PCBs, and components. Suitable for applications with limited installation space. ■ULTIMA (Forced Air Cooling) Suitable for air cooling of industrial control equipment, AC drives, inverters/converters, and renewable energy-related equipment using IGBT and SiC power semiconductors and power devices. Capable of handling high power (KW level). Evaluation kits are available. Customization options are also possible. For more details, please refer to the catalog and product page.
Price range
Delivery Time
Model number/Brand name
CooliBlade
Applications/Examples of results
■Cooling of various power electronics products and industrial sector products - AC drives - Variable frequency drives (VFD) - Air cooling of IGBT, SiC power semiconductors, and power devices - Smart grid - Inverters - E-mobility, electric vehicles - EV charging stations - Batteries - Data centers - Air cooling in renewable energy-related equipment
catalog（2）
Download All Catalogs
News about this product（3）
-
24th SMART ENERGY WEEK [Autumn] International Wind Power Exhibition
Scheduled Products for Display - Heat Sink Module for Power Electronics: AURORA - High Power (KW) Heat Sink Module for Power Electronics: ULTIMA - FBG (Temperature and Strain Sensor) - Terahertz Imaging System: uSense - Motion Scope DIC (Digital Image Correlation) Strain Measurement System - Optical Fiber Acoustic Microphone: PHANTOM - Optical Fiber Dynamic Pressure Sensor: Alpheus - FTIR Gas Detection Device: SPEYE Hyper
-
Power Device & Module EXPO (Nepcon Japan)
We will be exhibiting at the 2nd Power Device & Module EXPO (Nepcon Japan) to be held at Tokyo Big Sight from January 22 (Wednesday) to January 24 (Friday), 2025. We plan to introduce Cooliblade's cooling elements as thermal management solutions for power electronics.
-
We will be exhibiting at TECHNO FRONTIER 2024 (the 26th Thermal Design and Countermeasure Technology Exhibition).
We will be exhibiting at TECNO FRONTIER 2024 (the 26th Thermal Design and Management Technology Exhibition) held at Tokyo Big Sight from July 24 (Wednesday) to July 26 (Friday), 2024. ■Cooling Elements for Power Electronics https://www.klv.co.jp/product/others/comet.html We plan to introduce Cooliblade's cooling elements as thermal management solutions for power electronics.
