[Grinding Device] Tape Grinding Unit "BM Series"
Polishing equipment that maximizes the characteristics of polishing film.
The "BM Series" tape polishing unit is a polishing device that maximizes the characteristics of polishing films. Depending on the material of the workpiece, surface roughness management can be easily achieved by selecting the controller and polishing tape. 【Features】 ○ Lightweight and compact design ○ PLC control adopted ○ Capable of dry and wet polishing ○ Soft pressure and fixed-position polishing possible ○ Simplified tape replacement work For more details, please contact us or download the catalog.
basic information
【Specifications】 ○ Model: BM-100R(L) / BM-75R(L) / BM-50R(L) ○ Abrasive tape width: 100mm / 75mm / 50mm ○ Abrasive tape roll diameter: φ150mm ○ Abrasive tape feed speed: 0–50mm/min ○ Oscillation: 2mm (can be changed to 0–4mm with cam replacement) ○ Dimensions of the device: W330×D550×H355mm / W280×D550×H355mm / W255×D550×H355mm ○ Weight of the device: 40kg / 35kg / 33kg ○ Options: Contact rollers, pads, coolant supply unit, various jigs ○ Utilities: Power supply: 1φAC200V, Air: Constant 0.5MPa ● For more details, please contact us or download the catalog.
Price information
Please contact us.
Delivery Time
Applications/Examples of results
【Applications】 ○ Polishing of automotive parts ○ Polishing of rolls for printers and copiers ○ Polishing of OA equipment parts ○ Polishing of precision shafts ○ Precision polishing of other metals, rubber, and resin materials ● For more details, please contact us or download the catalog.
