[Information] Key Points for Reducing Gear Manufacturing Costs through Precision Shearing
Explanation of points regarding cost reduction for precision cutting gears!
This document introduces "Key Points for Reducing Gear Manufacturing Costs through Precision Shearing" for designers and engineers. It includes common concerns related to gears, such as "I want to mass-produce high-quality gears" and "I want to reduce gear costs at all costs," along with points for cost reduction. Additionally, we present examples where material changes and process transitions led to a 40% cost reduction. We encourage you to read it. [Contents (Excerpt)] ■ Common Concerns ■ Key Points ■ Our Features ■ Technical Proposal Examples ■ Product Examples *For more details, please download the PDF or feel free to contact us.
basic information
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Applications/Examples of results
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Detailed information
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■ System Architecture The sCT9002 SiPh wafer test system is equipped with an automatic wafer transport mechanism, allowing the transported wafers to be rotated and positioned on the stage. It also supports adjustments to the measurement temperature according to testing requirements. With an active optical alignment system and electrical probes, it couples/connects optical and electrical signals to each measurement device with high precision, automatically executing a series of wafer test processes.
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■ Automatic Wafer Handling With the sCT9002, you can choose between fully automatic mode and semi-automatic mode. The semi-automatic mode is mainly suitable for verification purposes in laboratories and prototype stages, allowing for flexible operation while keeping capital investment low. On the other hand, the fully automatic mode supports high throughput testing in mass production lines, significantly improving production efficiency.
