Aluminum base substrate [Noise and heat countermeasures with aluminum grounding]

Achieving grounding of the aluminum section! This improves the usability and design flexibility of the aluminum section.

When it comes to aluminum base substrates, the mainstream options are those that have an insulating layer pre-attached to aluminum, released by substrate material manufacturers. However, this limits the choice of aluminum thickness and the dielectric constant of the substrate to only what is available in the existing lineup, imposing restrictions on design. To address this, our company has developed a unique method of bonding the substrate to aluminum, allowing us to create aluminum base substrates using the desired substrate and aluminum. This significantly enhances design flexibility, enabling requests such as increasing aluminum thickness or using high-dielectric materials like Teflon or PPE for miniaturization. Additionally, post-bonding processing is possible, allowing for the creation of cavities for mounting components by machining only the substrate portion. 【Features (Aluminum Base Through-Hole Substrate)】 ■ Method of bonding substrate material to aluminum - High-frequency bonding film - Eutectic solder (lead-free options available upon consultation) ■ Achieves grounding of the aluminum section ■ Dramatically improves the usability of the aluminum section ■ Automatic mounting via reflow is also possible (in collaboration with partner companies) *For more details, please refer to the PDF document or feel free to contact us.

basic information

【Features (Solder Bonded Aluminum Base Substrate)】 ■ There are two bonding methods available, which can be selected based on budget and application. ■ A method that adheres aluminum to the substrate using a bonding sheet. ■ A method that melts the solder plating applied to the aluminum through heat pressing, allowing it to bond with the copper foil portion of the substrate by alloying. ■ The aluminum part is grounded and has the same performance as aluminum base through-hole substrates. ■ It is possible to reduce the diameter of through-holes. ■ Increased design flexibility. *For more details, please refer to the PDF materials or feel free to contact us.