Problems with high-frequency substrates: I want to strengthen shielding measures.

Achieving grounding of the aluminum section! This improves the usability and design flexibility of the aluminum section.

When it comes to aluminum base substrates, the mainstream products are those that have an insulating layer pre-attached to aluminum, released by substrate material manufacturers. However, this limits the choice of aluminum thickness and the dielectric constant of the substrate to the existing lineup, imposing restrictions on design. Therefore, our company has made it possible to create aluminum base substrates using a unique method that bonds the substrate material to aluminum, allowing for customization according to your specifications. This significantly enhances design flexibility, enabling requests such as increasing aluminum thickness or using high-dielectric materials like Teflon or PPE for miniaturization. Additionally, post-bonding processing is possible, allowing for the creation of cavities by machining only the substrate portion to mount components. 【Features (Aluminum Base Through-Hole Substrate)】 ■ Method of bonding substrate material and aluminum ・High-frequency bonding film ・Eutectic solder (lead-free options available upon consultation) ■ Achieves grounding of the aluminum section ■ Dramatically improves the usability of the aluminum section ■ Automatic mounting via reflow is also possible (in collaboration with partner companies) *For more details, please refer to the PDF document or feel free to contact us.

basic information

【Features (Solder Bonded Aluminum Base Substrate)】 ■ There are two types of bonding methods available, which can be selected based on budget and application. ■ A method that adheres aluminum to the substrate using a bonding sheet. ■ A method that melts solder plating applied to aluminum through heat pressing, allowing it to bond with the copper foil part of the substrate by alloying. ■ The aluminum part is grounded and has the same performance as aluminum base through-hole substrates. ■ It is possible to reduce the diameter of through-holes. ■ The design flexibility is improved. * For more details, please refer to the PDF materials or feel free to contact us.