[Concerns about Device Assembly] It requires technology to mount the circuit board onto the aluminum casing.

Achieving grounding of the aluminum section! This improves the usability and design flexibility of the aluminum section. By pre-installing and securing with screws, labor reduction becomes possible!

When it comes to aluminum base substrates, the mainstream products are those that have an insulating layer pre-attached to aluminum, released by substrate material manufacturers. However, this limits the choice of aluminum thickness and the dielectric constant of the substrate to only what is available in the existing lineup, imposing restrictions on design. Therefore, our company has made it possible to create aluminum base substrates using a unique method that bonds the substrate material to aluminum, allowing for customization according to your specifications. This significantly enhances design flexibility, enabling requests such as increasing aluminum thickness or using high-dielectric materials like Teflon or PPE for miniaturization. Additionally, it is possible to process the substrate after bonding, allowing for the creation of cavities for mounting components by machining only the substrate portion. 【Features (Aluminum Base Through-Hole Substrate)】 ■ Method of bonding substrate material and aluminum - High-frequency bonding film - Eutectic solder (lead-free options available upon consultation) ■ Realization of GND connection for the aluminum part ■ Dramatic improvement in the usability of the aluminum part ■ Automatic mounting via reflow is also possible (in cooperation with partner companies) *For more details, please refer to the PDF document or feel free to contact us.

basic information

【Features (Solder Bonded Aluminum Base Substrate)】 ■ There are two types of bonding methods, which can be selected based on budget and application. ■ A method that adheres aluminum and the substrate using a bonding sheet. ■ A method that melts the solder plating applied to the aluminum using heat press, bonding it with the copper foil part of the substrate through alloying. ■ The aluminum part is grounded and has the same performance as aluminum base through-hole substrates. ■ Miniaturization of through-holes is possible. ■ Design flexibility is improved. * For more details, please refer to the PDF materials or feel free to contact us.