Thick-film printed circuits for electronic component applications on in-house manufactured ceramic substrates.
We will form the circuit designed by you on our original ceramic substrate using thick film printing. Please feel free to proceed from prototyping to mass production.
Our alumina double-sided circuit boards can form connections between front and back patterns thanks to our unique through-hole manufacturing technology. Until now, embedding conductors in through-holes has been considered difficult due to the shrinkage of conductors during firing. However, we have independently developed a paste that controls firing shrinkage and an optimal process, enabling the supply of alumina printed circuit boards with a via structure filled with conductive paste in the through-holes. We believe our unique technology is the best solution to meet the demands for miniaturization, high functionality, and improved reliability that could not be achieved with conventional alumina printed circuit boards. Printing film materials: ■ Silver ■ Silver-Palladium ■ Silver-Platinum ■ Platinum ■ Copper ■ Gold ■ Ruthenium ■ Glass (insulating) Plating surface treatment for printed circuit boards: - Compatible with both electroplating and electroless plating. Plating types: ■ Nickel ■ Palladium ■ Gold ■ Silver ■ Copper ■ Others
basic information
Since it is manufactured using the high-temperature co-fired ceramics (HTCC) process, it has superior mechanical stability compared to the low-temperature co-fired ceramics (LTCC) process. Additionally, because it can be fired in an atmospheric furnace, production in a continuously operating firing furnace is possible, making it suitable for small batch prototype products compared to hydrogen firing furnaces that require batch processing. The printed circuit primarily uses platinum-based materials (Pt materials), so surface plating treatment is unnecessary (although additional plating can be accommodated).
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Applications/Examples of results
■Features and Examples of Applications of Thick Film Printed Circuit Ceramic Substrates■ 【Features】 Contributes to miniaturization/thinness Small diameter through-hole structure Double-sided wiring for power lines Realization of reduced thermal resistance (thermal vias) Through-hole structure filled with conductive fillers Multilayer printed circuit structure Pad-on-via structure Laser processing also available 【Examples of Applications】 Oscillators, oscillating devices MEMS devices Thick film circuit substrates with built-in resistors Various sensor substrates Hybrid ICs Insulating circuit substrates
Detailed information
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By forming circuits on a tough zirconia substrate, "curved circuits" and "flexible printed circuits" can be realized.
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It is possible to form circuits on the "ultra-thin zirconia substrate (thickness: 0.05mm)" that is thin enough to be see-through. This enables implementation in spaces with thickness constraints, allowing for the realization of thinner finished products.
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The inner layer circuit ceramic substrate does not show printed circuits on its surface. It can be applied to developments such as ceramic heaters.
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This is a photo of the front and back of the inner layer circuit ceramics. In the photo taken from the back with light shining on it (right side), the inner layer circuit can be seen through the transparency.
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Kyoritsu Elex Co., Ltd. is a specialized manufacturer of ceramic substrates for electronic circuits that has been in business for over half a century since its establishment. Our products are widely used as key components in the internal electronic parts of various products, including mobile phones, computers, LCD televisions, automotive control circuits, and more. Based on the know-how we have cultivated over the years, we aim to continue supplying products that meet the needs of the times to the ever-evolving electronics industry, and we aspire to contribute to the creation of a richer society.