Ceramic substrate for LED packages
In recent years, with the miniaturization, lightweight design, and high performance of electronic devices, the importance of heat dissipation measures due to high-density mounting of electronic components has been increasing.
In particular, with high-brightness LEDs, it has become difficult to implement heat resistance measures with resin package specifications, making alumina ceramics materials indispensable for heat dissipation and heat resistance. Additionally, due to the recent increase in demand for ultraviolet LEDs, interest in ceramic packages has been rising. Our company offers ceramic package substrates with excellent heat resistance characteristics based on our unique technology. Our unique technology for "improving heat dissipation performance" has become increasingly important alongside the high brightness (high output) of LED elements, leading to a significant rise in the demand for heat resistance in packaging materials and heat dissipation characteristics. We have received many inquiries regarding "improving heat dissipation using a general-purpose alumina ceramics substrate compared to a heat-dissipating aluminum nitride substrate." By applying our unique printed circuit technology, we process through-holes in the alumina ceramics substrate and fill the through-hole sections with "special silver-based materials," achieving a higher heat dissipation effect than typical alumina ceramics substrates.
basic information
【Features】 Characteristics of alumina ceramic substrates (Heat resistance, chemical resistance, etc.) Realization of "high heat dissipation" utilizing printed circuit technology Realization of "high design flexibility" through sheet molding technology Realization of "high reflectivity" through surface treatment of high-reflective materials
Price range
Delivery Time
Applications/Examples of results
Features and Examples of Applications for Ceramic Substrates for LED Packages 【Features】 - Characteristics of alumina ceramic substrates (heat resistance, chemical resistance, etc.) - Realization of "high heat dissipation" using printed circuit technology - Achievement of "high design flexibility" through sheet molding technology - Realization of "high reflectivity" through surface treatment of high-reflective materials 【Examples of Applications】 - High-brightness chip LED packages - Packages for other devices
Detailed information
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LED package substrate with reflector
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Metal base with reflector LED package substrate
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Reflector for LED packages
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We can also accommodate glossy silver plating on metal frames.
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Alumina printed circuit board with high reflection reflector - Requires fewer molds. - High degree of freedom in design changes.
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"Providing split slits for individual piece formation through mold shaping" "1. Removal of the frame part", "2. Barb break (strip shape)", "3. Chip break (individual piece formation)" makes it easy to achieve individual piece formation.
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Gold plating processing is also available.
