High-precision mold pressing technology for ceramic green sheets
The green sheet is soft and sheet-like before sintering, making processes such as slitting and mold processing relatively easy.
Mold Press Processing of Green Sheets Our ceramic substrate manufacturing involves firing green sheets made from blended raw materials that have been coated onto sheets. These green sheets are soft and in sheet form before sintering, making processes such as slitting and mold processing relatively easy. By applying press processing using high-precision molds for these sheet processes, we can accommodate processing specifications such as "non-standard shapes," "through holes," and "split slits" for the ceramic substrates after sintering.
basic information
High-Precision Mold Pressing for Fine Processing By using mold pressing on green sheets processed through an in-house integrated process, we achieve molding that meets customer specifications. In particular, by utilizing precision mold pressing technology, we enable "fine and micro-processing." For examples such as chip resistors, we have a production record for the minimum chip size of 0603 (0.6mm × 0.3mm). We have also achieved mass production with a minimum depth of 0.08mm for split slits. By applying advanced slit management, we can provide "split chip sizes of 50% of the board thickness." In addition to flat substrate shapes, we also accommodate three-dimensional mold pressing, with proven results in molding "three-dimensional pillar chips of less than 0.5mm."
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Applications/Examples of results
In the case of chip resistors, there is a production record for the minimum chip size: 0603 (0.6mm × 0.3mm). For split slits, mass production has been achieved with a minimum depth of 0.08mm. By applying advanced slit management, we can provide a "split chip size of 50% of the board thickness."
