Circuit formation technology by printing method - Ceramics
Printing materials are not limited to wiring materials (metal pastes); printing formation is also possible with insulating glass materials and ceramic materials.
Technology for Forming Printed Circuits on Ceramic Substrates Our company utilizes technology for forming printed circuits for electronic component applications on ceramic substrates manufactured in-house, all handled through an integrated in-house process. By using screen printing methods, we can offer custom solutions with shorter lead times compared to etching methods. Additionally, since the printed materials undergo high-temperature baking (850°C), they provide stable performance and high reliability. The printed materials are not limited to wiring materials (metal pastes) but also include insulating glass materials and ceramic materials, which can also be printed. Furthermore, we have achieved not only circuit formation but also "through-hole via formation" and "multilayer circuit structures." We are advancing technology development to meet various application possibilities, and we look forward to your inquiries.
basic information
Development of fine printing circuit technology for miniaturization of electronic devices Further fine wiring technology We are currently offering printed circuit products with "L/S = 50/50μm" as fine printed circuits. Please visit the page for "Fine Printed Circuit Ceramic Substrates." In response to the demand for miniaturization of electronic devices, we are advancing the development of further fine patterning.
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Applications/Examples of results
Single-sided multilayer ceramic substrate utilizing screen printing technology With the recent demands for both high functionality and miniaturization of electronic devices, there is an increasing requirement for multilayer technology in substrates. Additionally, the importance of flexibility in responding to specification changes, along with small lot production and shorter delivery times, is also being emphasized. Conventional multilayer substrate technology typically requires the preparation of molds for each layer of the laminated substrate, as it involves pressing a base substrate that has been molded. In contrast, our "multilayer technology printing utilizing screen printing" allows for adaptation by creating a printing pattern plate, without the need for molds for substrate processing. This makes it easier to accommodate changes in design specifications.
Detailed information
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"The technology is still under development, so please contact us for the latest information." Fine printing pattern (35μm) L/S = 35/35μm
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Conventional general multilayer substrate technology requires the preparation of molds for the number of layers in the laminated substrate, as it involves multilayering a molded base substrate through pressing. In contrast, our "multilayering technology using screen printing methods" allows for adaptation by creating a printing pattern plate, except for the molds used for substrate processing. This makes it easier to accommodate changes in design specifications.
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Through-hole processing for electrical connection It is possible to form through-holes for electrical connection on both sides of the substrate. By applying printed wiring technology, you can choose between "inner wall connection specification" and "filled connection specification." Additionally, the diameter of the through-hole can be accommodated down to φ0.2mm. Conductive film application technology for micro through-holes Conductive film application technology for micro through-holes Left: Filled connection specification Right: Inner wall connection specification
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Multilayer technology using screen printing method The figure below shows "Sample Example Photo (left)" and "Image Structure Diagram (right)." The sample case here is created with the following specifications: 【Surface Layer】 Conductive material (Ag-based) printed using screen printing 【Insulation Layer (Middle Layer)】 Glass material printed using screen printing (thick film) 【Inner Layer】 Printed circuit formation on a ceramic substrate
