Circuit formation technology using printing methods by Kyoritsu Elex.
Please consult with a specialized manufacturer of high-performance ceramic substrates.
Technology for Forming Printed Circuits on Ceramic Substrates Our company offers a comprehensive in-house process for forming circuits aimed at electronic component applications on ceramic substrates manufactured internally, utilizing advanced printed circuit formation technology. By employing screen printing methods, we can provide custom solutions with shorter lead times compared to etching methods. Additionally, the printed materials undergo high-temperature baking (850°C), ensuring stable performance and high reliability. The printed materials are not limited to wiring materials (metal pastes) but also include insulating glass materials and ceramic materials, which can also be printed. Furthermore, we have achieved not only circuit formation but also the creation of "through vias" and "multilayer circuit structures." We are advancing technology development to meet various application possibilities, and we look forward to your inquiries.
basic information
Development of fine printing circuit technology for miniaturization of electronic devices Further fine wiring technology We are currently offering printed circuit products with a line/space of "L/S = 50/50 μm" as fine printed circuits. Please visit the page for "Fine Printed Circuit Ceramic Substrates." In response to the demand for miniaturization of electronic devices, we are advancing the development of further fine patterning.
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Applications/Examples of results
Single-sided multilayer ceramic substrates utilizing screen printing technology With the recent demand for both high functionality and miniaturization of electronic devices, there is an increasing requirement for multilayer substrate technology. Additionally, the importance of flexible responses to specification changes, along with small lot production and shorter delivery times, is also being emphasized. Traditional multilayer substrate technology typically requires the preparation of molds for each layer of the laminated substrate, as it involves pressing a molded base substrate to create multilayers. In contrast, our "multilayering technology using screen printing" allows for the creation of printed pattern plates instead of requiring molds for substrate processing. This makes it easier to accommodate changes in design specifications.
Detailed information
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"The technology is still under development, so please contact us for the latest information." Fine printing pattern (35μm) L/S = 35/35μm
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Through Hole Conductive Processing It is possible to form conductive through holes for the electrical connection of both sides of the substrate. By applying printed wiring technology, you can choose between "inner wall conductive specification" and "hole-filling conductive specification." Additionally, the diameter of the through hole can be accommodated down to φ0.2mm. Conductive Coating Technology for Micro Through Holes Conductive Coating Technology for Micro Through Holes Left: Hole-filling conductive specification Right: Inner wall conductive specification
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In our "multilayer printing technology using screen printing methods," we can accommodate all aspects except for the mold for substrate processing by creating printing pattern plates. This makes it easier to respond to changes in design specifications.
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Multilayer technology using screen printing method The figure below shows "Sample Example Photo (left)" and "Image Structure Diagram (right)." The sample case here is created with the following specifications: 【Surface Layer】 Conductors (Ag-based) printed using screen printing 【Insulation Layer (Middle Layer)】 Glass material printed using screen printing (thick film) 【Inner Layer】 Printed circuit formation on a ceramic substrate
