Technology for improving heat dissipation performance using printed circuit technology.
For high-performance ceramic substrates, please consult our specialized manufacturer.
With the increase in brightness (high output) of LED elements, the importance of heat resistance in packaging materials has grown significantly, along with the demand for heat dissipation characteristics. We have received many inquiries regarding heat dissipation measures, particularly about "improving heat dissipation using general-purpose alumina ceramic substrates compared to aluminum nitride substrates, which have excellent heat dissipation properties." Our company applies unique printed circuit technology to process through-holes in alumina ceramic substrates and fills the through-hole sections with "special silver-based materials," achieving higher heat dissipation effects than typical alumina ceramic substrates.
basic information
Improvement technology for heat dissipation performance using printed circuit technology. Our developed heat dissipation improvement technology has achieved a thermal conductivity of 369 W/mk with alumina ceramic substrates.
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Applications/Examples of results
Features and Examples of Applications for Ceramic Substrates for LED Packages 【Features】 Characteristics of Alumina Ceramic Substrates (Heat resistance, chemical resistance, etc.) Realization of "high heat dissipation" utilizing printed circuit technology Realization of "high design flexibility" through sheet molding technology Achievement of "high reflectivity" through surface treatment of high-reflective materials 【Examples of Applications】 High-brightness chip LED packages Other device packages
