Plating surface treatment on printed circuit boards / Nickel / Palladium / Gold / Silver / Copper
For high-performance ceramic substrates, please consult our specialized manufacturer.
Printing film materials ■ Silver ■ Silver-platinum ■ Silver-palladium ■ Platinum ■ Copper ■ Gold ■ Ruthenium ■ Glass (insulating) Plating surface treatment for printed circuit boards - Compatible with both electroplating and electroless plating Plating types ■ Nickel ■ Palladium ■ Gold ■ Silver ■ Copper ■ Others
basic information
【Features】 Contributes to miniaturization/thinness Small diameter through-hole structure Double-sided wiring of power lines Realization of reduced thermal resistance (thermal vias) Through-hole structure filled with conductive fillers Multilayer printed circuit structure Pad-on-via structure Laser processing also available
Price range
Delivery Time
Applications/Examples of results
【Examples of Use】 Oscillators, oscillation devices MEMS devices Thick film circuit boards with built-in resistors Various sensor substrates Hybrid ICs Insulator circuit boards
Detailed information
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Zirconia printed circuit board By forming circuits on a tough zirconia substrate, "curved circuits" and "flexible printed circuits" can be realized.
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Zirconia printed circuit board It is possible to form circuits on the "ultra-thin zirconia substrate (thickness: 0.05mm)" that is thin enough to be translucent. This enables implementation in spaces with thickness constraints, allowing for thinner finished products.
