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Ceramic thin plate chip break (segmentation) chocolate break

For high-performance ceramic substrates, please consult our specialized manufacturer.

"Providing split slits for individualization through mold forming" "1. Removal of the frame part", "2. Barb break (strip shape)", "3. Chip break (individualization)" makes individualization easy.

Application of our ceramics technology to "LED packages"

basic information

**Features** Characteristics of alumina ceramic substrates (Heat resistance, chemical resistance, etc.) Realization of "high heat dissipation" utilizing printed circuit technology Realization of "high design flexibility" through sheet molding technology Realization of "high reflectivity" through surface treatment of high-reflective materials

Price range

Delivery Time

Model number/Brand name

3535 5050 1010

Applications/Examples of results

【Usage Examples】 High Brightness Chip LED Package Other Device Packages

Detailed information

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