Our company will be exhibiting at the "Electronic Devices 2021 Total Solution Exhibition (JPCA Show)" held at Tokyo Big Sight from October 27 (Wednesday) to 29 (Friday), 2021. We will provide new solutions in the field of electronic devices with our film technology. We look forward to your visit. 【Exhibited Products Introduction】 ◆ High-Temperature Resistant Press Cushion Material 'Keiju' ... A composite material made of silicone rubber film and heat-resistant substrate. It offers high customization and can be reused at high temperatures (up to about 300°C). It contributes to reducing environmental impact as it is not disposable. ◆ "Flexible Epoxy Film" ... In addition to the excellent adhesion unique to epoxy resin, it also offers rubber-like flexibility and resilience. It can be applied to various uses, including stretchable and wearable applications. ◆ High-Speed Communication Substrate Material New 'IBUKI' (First Public Release) ... Is IBUKI making a comeback!? Upgraded as a 5G-compatible material. It retains low CTE and low-temperature processing while adding high-frequency characteristics. This will be publicly unveiled for the first time at this exhibition. Please look forward to it! *We plan to exhibit a total of 14 products, including those mentioned above.

We will be exhibiting our resin film and metal laminated material "Alset" at the "2024 Automotive Technology Exhibition." Since the film is laminated to the metal from the start, it offers the following advantages: - Omission of the insulation film lamination process - Omission of the metal coating process - Miniaturization and space-saving of components (reduction of insulation distance) - Compatibility of insulation and heat dissipation (when compared to resin) Expected applications: Capacitor cases, cases for batteries and electronic components, etc. When the film layer of Alset and the resin to be molded are compatible for thermal welding, the film and molded resin will thermally weld together in the mold and become integrated after cooling. - Composite of metal and resin using only heat - Weight reduction of metal - Electromagnetic wave shielding capability of resin - Improved heat dissipation Expected applications: ECU and PCU enclosures and components, general automotive components such as battery parts Date: May 22 (Wednesday) to May 24 (Friday), 2024 Day 1 and Day 2: 10:00 AM to 6:00 PM Day 3: 9:00 AM to 4:00 PM Location: Booth 244 Please feel free to stop by.

We will be exhibiting our resin film and metal laminated material "Alset" at the "2024 Automotive Technology Exhibition in Nagoya." Since the film is laminated onto the metal, the following functions can be achieved: - Omission of the insulation film lamination process - Omission of the metal painting process - Miniaturization and space-saving of components (reduction of insulation distance) - Compatibility of insulation and heat dissipation (when compared to resin) Expected applications: Capacitor cases, cases for batteries and electronic components, bus bars If the film layer of Alset and the resin to be molded are compatible for thermal welding, the film and molded resin will thermally weld together in the mold, resulting in the following functions after cooling: - Composite of metal and resin using only heat - Weight reduction of metal - Electromagnetic wave shielding capability of resin - Improved heat dissipation Expected applications: ECU and PCU enclosures and components, general automotive components such as battery parts Event dates: July 17 (Wednesday) to July 19 (Friday), 2024 Opening hours: All three days: 10:00 AM to 5:00 PM Venue: Aichi Sky Expo (Aichi Prefectural International Exhibition Center) Booth: 9 Please feel free to stop by!

We will be exhibiting at the "39th NEPCON Japan Electronics Development and Manufacturing Expo (26th Electronic Components and Materials EXPO)" to be held at Tokyo Big Sight from January 22 (Wednesday) to January 24 (Friday), 2025. Please stop by our booth at East Hall 3, E21-2. At the exhibition, we will introduce "Alset," a metal and resin film laminated material. Alset is an ideal material for next-generation laminated busbars and flexible busbars. It enables high current and high frequency busbars suitable for electric vehicles while also allowing for weight reduction. Additionally, its flexibility helps eliminate cracking caused by vibrations in vehicles. Event Name: 39th NEPCON Japan Electronics Development and Manufacturing Expo (26th Electronic Components and Materials EXPO) Dates: January 22 (Wednesday) to January 24 (Friday), 2025 Venue: Tokyo Big Sight, East Hall 3, E21-2 Official Website: https://www.nepconjapan.jp/tokyo/ja-jp.html We sincerely look forward to your visit.