Resin paste coater
Suitable for the coating process of power devices, MEMS, and ultra-small electronic component manufacturing!
The "Resin Paste Coater" is a product equipped with a Twin-air dispenser that applies the necessary amount of material precisely to the targeted position without waste. Compatible workpieces include various 4 to 12-inch wafers, chip-level substrates, glass substrates, ceramic substrates, resin films, and metal substrates. It also supports polyimide, high-viscosity resist, other high-viscosity liquids, solder paste, solder resist, and flux. 【Performance】 - Full-area coating, chip marking, L/S drawing - Dam structure formation, dot application, localized coating/sealing - Edge cut settings, achieving coating that avoids notches - No overflow of liquid – no need for side and back rinsing - CAD data import for coating area/pattern shape - Maximum film thickness of 100μm, minimum width of 50μm/Φ50μm *For more details, please download the PDF or feel free to contact us.
basic information
【Specifications (Excerpt)】 ■WL Series (Wafer, Substrate Level) - Nozzle inner diameter sizes (μm): 25, 40, 70, 100, 150, 200 (standard), 300 to 1000 (custom) - Compatible substrates: 6 to 12-inch wafers, various substrates up to 300mm square - X-Y stage drive: AC servo motor ball screw, or linear motor - Loader/Conveyor: Optional (custom options available) - Pre-aligner: Optional (for wafers) *For more details, please download the PDF or feel free to contact us.
Price range
Delivery Time
Applications/Examples of results
【Application Examples】 ■ Wafer Level ■ Chip (Tray) Level ■ Coating on Special Shapes *For more details, please download the PDF or feel free to contact us.
