CMP Pad Conditioner
Achieving a strong chemical bond at the molecular level between diamond abrasives and substrates! For use in CMP processes.
We propose a unique structure of pad conditioner covered with diamond for use in the CMP process by Morgan Advanced Ceramics. This structure features diamond abrasives coated on a silicon substrate or a ceramic substrate using CVD. We have achieved a strong chemical bond at the molecular level between the diamond abrasives and the substrate. It also has strong slurry resistance, with no chemical erosion from the slurry. Additionally, there is no loss or crushing of the diamond, and control over the density of the diamond abrasives is possible. For more details, please contact us.
basic information
【Features】 ○ Used in CMP processes ○ A unique structure of pad conditioner covered with diamond on the surface ○ A structure where diamond abrasives are CVD coated on silicon and ceramic substrates ○ Achieves a strong chemical bond at the molecular level between diamond abrasives and the substrate ○ Strong resistance to slurry, with no chemical erosion from slurry ○ No loss or grinding of diamond ○ Control of diamond abrasive density is also possible ● For more details, please contact us.
Price information
Please contact us.
Delivery Time
Applications/Examples of results
【Usage】 ○ Conditioning of pads in the CMP process ● For more details, please contact us.
