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Microblast device

The insulating film can be removed without damaging the substrate.

From pinpoint spots to the entire circuit board, we can blast-remove insulating films (such as parylene, urethane, acrylic, etc.). Even for components that are susceptible to electrostatic discharge (ESD), our unique ionizer effectively reduces damage to the components. By minimizing the flow during blasting, we have been able to reduce damage compared to other products. Additionally, we use our proprietary blasting powder (Carbo Blast 25A electronic grade powder).

basic information

From pinpoint spots to the entire circuit board, we can blast-remove insulation films (such as parylene, urethane, acrylic, etc.). Even for components that are susceptible to electrostatic discharge (ESD), our unique ionizer effectively reduces damage to the components.

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Applications/Examples of results

Medical, semiconductor, electronics

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