Piezoelectric film forming device
It is a film deposition device specialized for the production of MEMS and FBAR.
basic information
Principle: DC, AC (Dual Magnetron) Sputtering Features Film deposition of AlN, AlScN (piezoelectric) films, Mo (metal) films Excellent stress control/distribution Crystallinity High throughput High yield High maintainability Compatible with 200 mm wafers Very compact design From R&D to mass production equipment World's leading market share in FBAR applications Applications For FBAR, MEMS, and sensors Delivery record Domestic: multiple units Overseas: numerous units delivered
Price range
Delivery Time
Applications/Examples of results
For filters such as MEMS and FBAR Domestic: Multiple units Overseas: Numerous units delivered
