Multilayer film formation device (Polyparaxylene + ALD)
We alternately stack polyparaxylylene (Parylene) and inorganic oxide layers using atomic layer deposition (ALD).
Parylene is a high-performance resin with biocompatibility, but it has the disadvantage of lower gas barrier properties compared to inorganic oxides. Therefore, by alternately depositing Parylene and oxides like a sandwich, it becomes possible to create high-performance films with excellent barrier properties, making it ideal for medical applications that require miniaturization and thin films. Parylene and ALD can be deposited in the same chamber (in-situ) without breaking the vacuum, so there is no concern about particles. Additionally, manufacturers have process know-how, so information regarding recipes can also be provided. We also conduct demonstration film deposition, so please feel free to contact us.
basic information
- Polyparaxylene has excellent insulation, barrier, antibacterial, and biocompatibility properties. - Precursors: Poly-paraxylene, Poly-chloroparaxylene, Poly-dichloroparaxylene (materials are also available for sale). - Parylene C (poly-paraxylene) has excellent biocompatibility and has also obtained FDA certification. - Film formation process: Coating is performed using a dedicated vacuum deposition device at room temperature. When solid granular raw materials called dimers are heated under vacuum, they vaporize into dimer gas. This gas undergoes thermal decomposition, causing the dimer to cleave and transform into a monomer form. Inside the room temperature deposition chamber, this monomer gas polymerizes on all surfaces, forming a thin, transparent polymer film.
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Applications/Examples of results
☆Medical Device Applications: Stents Cardiac Support Devices Mandrels & Molds Catheters Elastomer Seals Needles & Epidural Probes Medical Electronic Devices ☆Electronics Coating Applications: Printed Circuit Boards & Assemblies Sensors LEDs MEMS Capacitors Wafers Ferrite Cores Video Displays Metal Parts ☆Defense / Aerospace Coating Applications: MEMS Sensors Circuit Card Assemblies Motor Parts Power Supplies Backplanes Elastomer Parts
