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"Complete sealing of electronic components in just a few dozen seconds. Ideal for waterproofing, dustproofing, and insulation!" Hot melt molding is gaining attention for the waterproof sealing of electronic components.

●What is Hot Melt Molding? It is a technology that demonstrates excellent sealing performance by directly injecting hot melt adhesive into electronic components. □Advantages of Adoption 1. Reduction in Processing Time Hot melt molding completes one molding cycle in about 10 seconds to several tens of seconds. There is no need for curing time like in potting. 2. Reduction in Number of Parts Hot melt molding eliminates the need for a case. This allows for a reduction in the number of parts and production man-hours. 3. Miniaturization and Weight Reduction Hot melt molding can be shaped with minimal wall thickness along the insert components. This is expected to reduce the amount of resin used, leading to miniaturization and weight reduction. Matsumoto Processing will respond quickly to the selection of suitable hot melts, modeling of molding shapes, analysis, mold production, and prototyping after understanding the reliability required for your products. For customers wishing to introduce hot melt sealing processes in-house, we provide comprehensive support including the production and sale of molding machines and molds, development of molding parameters, process startup assistance, and supply of hot melts. For customers who wish to outsource the hot melt sealing process, we offer contract molding services.