三菱ガス化学株式会社 グリーン・エネルギー&ケミカル事業部門 Official site

Examples of Suprem Film Molding

Introducing examples of film molding of Surprim, boasting low dielectric properties and high toughness, with Tg of 185°C and Tm of 323°C!

Here is an introduction to examples of film molding using "Saprime." "Saprime" is a thermoplastic polyimide resin that exhibits a balanced glass transition temperature (Tg 185°C) and melting point (Tm 323°C) compared to super engineering plastics such as PEEK and PEKK. It combines high strength, high heat resistance, high solvent resistance, low dielectric constant (2.66 at 10GHz), and easy moldability. It is a crystalline TPI that maintains a high glass transition temperature while lowering the melting point, making it suitable for a wide range of applications such as CFRP matrix resins, CFRP toughness modifiers, compounds, and electrical and electronic applications. 【Features】 ■ Low dielectric properties ■ Low water absorption ■ High visibility ■ High toughness ■ High Tg (185°C) ■ Crystalline film *For more details, please refer to the PDF materials or feel free to contact us.

Related Link - https://www.mgc.co.jp/products/ac/therplim/index.h…

basic information

For more details, please refer to the PDF document or feel free to contact us.

Price range

Delivery Time

Applications/Examples of results

【Applications】 ■ 5G-related materials (UD tape, prepreg) ■ Alloy applications (PEEK, PEI, LCP) ■ Raw materials for CFRP ■ Acoustic device components ■ FPC substrates (copper-clad laminates), etc. *For more details, please refer to the PDF document or feel free to contact us.

catalog(13)

Download All Catalogs

Low dielectric thermoplastic polyimide "Saprime" for high-speed communication devices (5G)

PRODUCT

Product Information: "Thermoplastic Polyimide Resin - Sarprim"

PRODUCT

Product Information: "Thermoplastic Polyimide Resin - Surprime Sliding Grade TS Series"

PRODUCT

"Supreme" matrix resin for CFRP

PRODUCT

List of Applications for Thermoplastic Polyimide Resin "Saprime"

OTHER

"Therplim Supreme" × UD Tape

PRODUCT

Thermoplastic polyimide resin "Saprime" for super engineering plastic alloy applications.

PRODUCT

Base material TZ3300 for polyimide-based test sockets (ceramics-reinforced PI material)

PRODUCT

Thermoplastic polyimide for 5G highspeed communication equipment

PRODUCT

5G고속통신기기용 열가소성 폴리이미드

PRODUCT

Stock shape of polyimide for test socket TZ3300

PRODUCT

폴리이미드계 테스트소켓용 모재 TZ3300

PRODUCT

Product Information: "Thermoplastic Polyimide Resin, Non-Halogen Flame Retardant Grade TF1401C"

PRODUCT

Distributors

Recommended products