Low dielectric thermoplastic polyimide "Saprime" for high-speed communication devices (5G)
Super engineering plastics with excellent dielectric properties over a wide frequency range, suitable for next-generation (5G) communication equipment!
"Supreme" has excellent dielectric properties and is resistant to high temperatures and humidity, making it suitable for use in 5G-related components (copper-clad laminates), raw materials for CFRP, and parts for acoustic devices. 【Features】 ■ Good dielectric properties across a wide frequency range, including the millimeter wave region (10GHz 2.7) ■ High heat resistance (Tm323℃/Tg185℃) ■ Good chemical resistance and insoluble in solvents ■ Can be processed from thin films of less than 25μm to large components up to 100mm thick *For more details, please refer to the PDF document or feel free to contact us.
basic information
For more details, please refer to the PDF document or feel free to contact us.
Price range
Delivery Time
Applications/Examples of results
【Applications】 ■ 5G related materials (LCP, MPI alternatives) ■ Alloy applications (PEEK, PEI, LCP) ■ Raw materials for CFRP ■ Acoustic device components ■ FPC substrates (copper-clad laminates), etc. *For more details, please refer to the PDF document or feel free to contact us.
