Thermoplastic Polyimide Resin "Therplim"
Thermoplastic polyimide resin with unprecedented moldability and heat resistance.
Compared to super engineering plastics like PEEK and PEKK, "Therplim" has a well-balanced glass transition temperature (Tg185℃) and melting point (Tm323℃), featuring high strength, high heat resistance, high solvent resistance, and low dielectric constant. It is a thermoplastic polyimide resin that possesses characteristics of (10GHz 2.66) and is easy to mold. It is a crystalline TPI that maintains a high glass transition temperature while lowering its melting point, with a wide range of applications such as CFRP matrix resins, CFRP toughness modifiers, compounds, and electrical and electronic applications that utilize its properties. [Features] ■ Crystalline thermoplastic polyimide (granules, powders) ■ High heat resistance and high strength ■ Easy moldability ■ Reflow resistance ■ Low dielectric properties and high lubricity *For more details, please refer to the PDF document or feel free to contact us.
basic information
【Examples of Molding】 ■ Thin films (Copper-clad laminates for 5G, FPC) ■ Extruded parts (Automotive, aerospace, robotic components) ■ CFRP (UD tape, prepreg) ■ Injection molded products (Gears, bearings) *For more details, please refer to the PDF document or feel free to contact us.
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Applications/Examples of results
[Usage] ■ Gears, spacers, test sockets, sliding components, device components, electrical and electronic components, 5G-related (copper-clad laminates), matrix resins for composite materials such as CFRP (UD tape, prepreg), modified additives (CFRP resistance improvement), alloy applications (PEEK, PEI, LCP), etc. * For more details, please refer to the PDF document or feel free to contact us. Shanghai Lingxiao Trading Co., Ltd. http://shryoyo.com/index.html
