Low dielectric thermoplastic polyimide Therplim for high-speed communication devices (5G)
Suitable for super engineering plastics with good dielectric properties in a wide frequency range and materials for next-generation (5G) communication devices.
Due to its excellent dielectric properties and high temperature and humidity resistance, "Therplim" can be used in 5G-related materials (copper-clad laminates), CFRP raw materials, and audio equipment components. [Features] ■ Good dielectric characteristics across a wide frequency range, including the millimeter wave region (10GHz 2.7) ■ High heat resistance (Tm323℃/Tg185℃) ■ Good chemical resistance, insoluble in solvents ■ Can be processed from films below 25 μm to large components with a thickness of 100 mm * For more details, please refer to the PDF document or feel free to contact us.
basic information
For more details, please refer to the PDF document or feel free to contact us.
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Applications/Examples of results
[Usage] ■ 5G-related components (LCP, MPI alternatives) ■ Alloy applications (PEEK, PEI, LCP) ■ CFRP raw materials ■ Audio equipment parts ■ FPC boards (copper-clad boards), etc. * For more details, please refer to the PDF document or feel free to contact us. Shanghai Lingxiao Trading Co., Ltd. http://shryoyo.com/index.html
