Micro-dimple treatment for serrated edges

Countermeasures against edge chipping by applying compressive residual stress! MD treatment to suppress adhesion of the target object *Also compatible with PFAS regulations.

Our company performs "micro-dimple processing" on serrated edges. This process involves projecting fine particles with a diameter of several tens of micrometers onto the surface of the substrate, resulting in plastic deformation that forms micro dimples on the substrate surface. Additionally, this imparts compressive residual stress, improving the fatigue strength and sliding characteristics of the substrate. By further applying an ultra-thin DLC film, we can enhance durability and corrosion resistance without affecting cutting performance. 【Features】 - Improved fatigue strength and sliding characteristics of the substrate - Enhanced durability - Reduced cleaning frequency - Improved cleanability - Suppression of adhesion on the target object *For more details, please download the PDF or feel free to contact us.