Micro-dimple processing for automatic screening machines.
Highly effective for screening! Reduces passage time and resolves bottlenecks *Can also comply with PFAS regulations.
Our company performs "micro-dimple processing" on automatic sieves. MD processing involves projecting fine particles with a diameter of several tens of micrometers onto the surface of the substrate, resulting in plastic deformation that forms micro dimples, and this processing can also be applied to meshes. Additionally, the point contact between the wire surface and the powder helps to suppress adhesion and improve cleanability. 【Features】 ■ Improved yield due to suppression of powder adhesion ■ Increased strength and extended replacement cycle ■ Shortened passage time to eliminate bottlenecks *For more details, please download the PDF or feel free to contact us.
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