Introduction of thermal conductive filler dispersion liquid.
Improved hand-linking properties, reduced foreign matter due to miniaturization, and additional performance enhancements!
This document introduces a "thermal conductive filler" dispersion. The main applications of thermal conductive fillers include their use in molded products such as heat sinks and heat dissipation substrates. By slurrying thermal conductive ceramics, the potential for use in "thermal conductive adhesives, paints, films, coatings, and sheets" is expanded. The document provides detailed information on the various properties of thermal conductive fillers, including a dispersion of spherical alumina nanoparticles, using diagrams and photographs. We encourage you to read it. [Contents (partial)] ■ Applications of thermal conductive fillers ■ Properties of thermal conductive fillers ■ Dispersion of spherical alumina nanoparticles ■ Boron nitride dispersion ■ Flaky boron nitride dispersion ■ Spherical nanoparticle boron nitride dispersion (development product) *For more details, please refer to the PDF document or feel free to contact us.
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