All products and services
1～30 item / All 60 items
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A Windows tablet that can be widely used across various industries.
10.1-inch Windows tablet!!
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Sansa Electric Manufacturing Co., Ltd. SiC POWER MOSFET
FMG50AQ170N6
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Site-specific portable power supply "Goden"
Improve your work environment with silent and vibration-free operation! No worries about accidents caused by odors or exhaust gases.
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Portable Battery Power Supply "PVS+"
Dustproof and waterproof structure during use! Active in various places and situations such as nursing facilities and medical institutions.
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8L Rotary Solenoid
The total weight (X3·4·8·9) is approximately 3,056g. The standard heat sink is 520×520×3mm aluminum.
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8S Rotary Solenoid
The standard heat dissipation plate is made of aluminum measuring 520×520×3mm! The return spring torque ranges from 0.09 to 0.14 N·m.
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7S Rotary Solenoid
The total weight (X3・4・8・9) is approximately 1,013g. The standard heat sink is 390×390×3mm aluminum.
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6E Rotary Solenoid
The standard heat dissipation plate is made of aluminum measuring 310×310×3mm! The return spring torque is 0.045 to 0.065 N·m.
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6S rotary solenoid
The total weight (X3·4·8·9) is approximately 506g. The standard heat sink is 310×310×3mm aluminum.
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5E Rotary Solenoid
The standard heat dissipation plate is made of aluminum measuring 190×190×3mm! The return spring torque is 0.026 to 0.035 N·m.
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5S Rotary Solenoid
The total weight (X3・4・8・9) is approximately 250g. The standard heat sink is 190×190×3mm aluminum.
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4E Rotary Solenoid
The standard heat dissipation plate is made of aluminum measuring 160×160×3mm! The return spring torque is 0.0165 to 0.024 N·m.
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3E Rotary Solenoid
The total weight (X3·4·8·9) is approximately 97g. The standard heat sink is 120×120×3mm aluminum.
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2E Rotary Solenoid
The standard heat dissipation plate is made of aluminum measuring 90×90×3mm! The return spring torque is 0.0055 to 0.009 N·m.
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Application for Industrial Equipment: "SiC MOSFET"
Achieving the world's highest level of low loss! Samples are also available.
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Application for industrial equipment: "SiC Schottky Barrier Diode"
New SiC-SBD (low VF), compact surface mount package! AEC-Q101 compliant (planned).
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5th Generation FRD "Z Series" for PFC
Ultra-fast FRD, reducing recovery current by 40%! Low noise (reduction of noise countermeasure components)
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Ultra-Low VF Bridge Diode "LM Series"
Achieving world-class ultra-low VF! We would like to introduce our featured products.
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Full Bridge SiC-MOSFET Power Module
Adopted by major domestic customers in FA, industrial machinery, and robot devices!
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Canadian three-phase 50kW / 62.5kW power conditioner
Canadian Solar In-house Developed Power Conditioner
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Radiative Cooling Material_SPACECOOL
Delivering truly safe and comfortable coolness to the environment and the entire world through "zero energy" cooling.
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Three-phase 16.5kW hybrid storage system
Available for small and medium-sized enterprises even during power outages! Efficient use of solar power generation.
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Theft prevention measures for solar power plants! Security system linked to remote monitoring.
When the motion sensor detects an intrusion, it can intimidate the intruder with a siren-equipped rotating light and LED light! It will report the anomaly via email.
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Protecting power plants! The security system 'L-eye' linked with remote monitoring.
To prevent theft at solar power plants! When the motion sensor detects an intruder, it can intimidate the intruder with a siren-equipped rotating light and LED lights.
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IGBT module "GSA100AA60"
Compact, high-reliability SOT-227 standard package! Direct mounting to heat sinks is possible.
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IGBT module "GSA75AA120"
Insulation withstand voltage 2500V! A module that uses IGBTs specialized for high-speed performance.
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SiC MOSFET module "TechnoBlock Series"
Introducing our unique package and DioMOS technology fusion module!
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Module "SCA160/200DB・SCE160/200DB"
The adoption of a unique gate structure chip achieves high tolerance against lightning surges and other disturbances!
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Diode module "DCA200/240DB"
For applications such as generators and elevators! The synergy with solder bonding on both sides of the chip improves long-term reliability.
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SiC MOSFET『FMG50AQ120N6』
Achieves low RDS(on) to maximize the effective use of package space.
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