Supports automation! Achieves high productivity with the 'turntable-type circuit board separator'.
Improvement of productivity through parallel setup in the printed circuit board division process, also accommodating inline production processes!
By being able to prepare the next workpiece in parallel during substrate processing, we can eliminate waiting time during substrate exchanges. Additionally, by shortening the cycle time, productivity can be improved without increasing the number of operators. The entire process of supplying printed circuit boards, cutting the substrates, and palletizing the cut substrates onto discharge trays can also be automated. (Substrate cutting machine + robot transport system) 【Features】 ■ Equipped with a dual-table automatic turn system that allows for parallel setup ■ Adaptable to general inline specifications through the use of robots ■ Reduction of cutting time through Z-axis height settings for each router location ■ Improved operating rate by monitoring the usage distance of bits and automatically replacing them ■ Built-in dust collector for compact device size *For more details, please download the PDF or contact us. ★ For those interested in the single type, click here▽ https://mono.ipros.com/product/detail/2000569194 ★ Free seminar here▽ http://www.mtco-web.co.jp/products/web_seminar.html
basic information
【Specifications (Excerpt)】 ■Table: 2 tables (automatic turn method) ■Target board size (length × width): 250mm × 350mm, compatible with M size boards ■Board handling ・Board material: Glass epoxy (FR-4), resin boards such as CEM-3 Thickness: 0.4 to 2.0mm ・Positioning method: Positioning using jigs ■Basic performance ・X-Y axis positioning method: 2-axis AC servo control ・X-Y axis movement speed: Maximum 1,200mm/s ・Repeat positioning accuracy: ±0.01mm *For more details, please download the PDF or contact us.
Price information
Prices vary depending on the optional specifications, so please feel free to contact us.
Delivery Time
Applications/Examples of results
For more details, please download the PDF or contact us.
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Improving Productivity! Announcement of the September Web Seminar on Circuit Board Manufacturing Equipment
【September WEB Seminar (Duration: 30 minutes)】 You can easily participate for free in this WEB seminar using ZOOM! The seminar in September will cover the following topics. [Course] A turntable-type substrate divider that allows parallel operation with external arrangements, which is expected to improve productivity without increasing the number of operators, and the differences in productivity compared to a single table. ----▼Click here to register▼--------------------------------------------- By clicking the 'Details & Registration' button below, you can confirm the details and register! ------------------------------------------------------------------------
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Automation Support! Announcement of July WEB Seminar
【July WEB Seminar (Duration: 30 minutes)】 You can easily participate for free in our WEB seminar using ZOOM! The seminar in July will cover the following topic: [Course] Introduction to the "Board Cutting Machine + Robot Transport System," which can accommodate automation in-line from board supply to board cutting, palletizing onto transport trays, and tray transport, as well as automation in batch processing. ----▼ Click here to register ▼--------------------------------------------- By clicking the 'Details/Registration' button below, you can confirm the details and register! ------------------------------------------------------------------------
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Invitation to the Substrate Manufacturing Equipment Webinar
【June WEB Seminar (Duration: 30 minutes)】 You can easily participate for free in our WEB seminar using ZOOM! The seminar in June will cover the following course. [Course] We will introduce various cutting methods and features possible with our board splitting machine. ----▼ Click here to register▼--------------------------------------------- By clicking the "Details & Registration" button below, you can check the details and register! ------------------------------------------------------------------------
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Notice of Participation in the Total Solutions Exhibition for Electronic Devices 2025
We will be exhibiting the actual machines of the "PCB Cutting Machine" and "PCB Marking Device" at the Total Solution Exhibition for Electronic Devices, which will be held at Tokyo Big Sight from June 4 to June 6, 2025. We look forward to your visit to the Mitsubishi Electric Corporation booth on that day. <Location> Tokyo Big Sight, East Hall 5 Inside the Mitsubishi Electric booth (Booth No. 5H-10) <Exhibition Content> "PCB Cutting Machine" We will propose the standalone type 'MR2535H2' with a built-in dust collector for space-saving, and the turntable type 'MR2535H2T' that allows parallel setup during PCB cutting, enhancing productivity. "PCB Marking Device" We will propose high-resolution printing that supports fine printing of two-dimensional codes and characters necessary for the traceability of printed circuit boards, as well as compatibility with various materials.
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New Course Announcement! Information on the PCB Manufacturing Equipment Webinar
【February WEB Seminar (Duration: 30 minutes)】 You can participate for free and easily in this WEB seminar using ZOOM! The February seminar will hold the following two courses. [Course 1] A turntable-type substrate separator that allows parallel operation with external setup, enabling productivity improvement without increasing the number of operators, and the differences in productivity compared to a single table. [Course 2] Introduction to basic knowledge about laser marking, as well as the utilization and operation methods of substrate marking devices. ----▼ Click here to apply▼--------------------------------------------- By clicking the "Details/Application" button below, you can check the details and apply! ------------------------------------------------------------------------