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Conductive epoxy adhesive "Muromac Bond K-72-1 Series"

Conductive adhesive suitable for die bonding of electronic components.

It is a conductive epoxy adhesive with stable adhesion and resistance values.

Muromac Bond

basic information

For more details, please refer to the catalog or feel free to contact us.

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Applications/Examples of results

LED, die bonding of IC chips, crystal oscillators, etc.

Conductive epoxy adhesive "Muromac Bond K-72-1 Series"

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