32ch Differential I/O FPGA Mezzanine Card TFMC684
TEWS company's FPGA mezzanine card (FMC) is a mezzanine module compliant with ANSI/VITA 57.1.
The TFMC684 provides the capability to add a 32-bit M-LVDS (Multi-Point Low Voltage Differential Signaling) I/O interface or a 32-bit RS-485/RS-422 I/O interface to an FMC carrier card. TFMC684-10R: Compliant with TIA/EIA-899 standard (Type 2 receiver) TFMC684-20R: Compliant with TIA/EIA-485 and TIA/EIA-422 standards The 32-bit differential I/O is connected to the VHDCI-68 connector on the front panel.
basic information
■Specifications ・Form Factor: Single-width 10 mm stacking height FPGA Mezzanine Card (FMC) module ・Signal Voltage (VADJ): 1.2V to 3.6V; Nominal Voltage 1.8V ・M-LVDS Driver/Receiver: SN65MLVD206 (Texas Instruments) or compatible ・RS-485/RS-422 Transceiver: MAX3078E (Maxim Integrated) or compatible ・EEPROM: M24C02 (STMicroelectronics) or compatible ・Each Channel 200Mbit/s (M-LVDS), Each Channel 16Mbit/s (RS-485/RS-422) MAX ・I/O Connector: Front I/O VHDCI68 / SCSI-V (Honda HDRA-EC68LFDT-SL+ or compatible) ・Operating Temperature Range: -40°C to +85°C
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Model number/Brand name
TFMC684 - TEWS Technologies
Applications/Examples of results
It is used in industrial equipment, testing devices, measuring instruments, and embedded devices.
Line up（2）
| Model number | overview |
|---|---|
| TFMC684-10R | 32 M-LVDS I/O, FMC for VHDCI-68 front panel connector |
| TFMC684-20R | 32 RS485/RS422 I/O, LPC-FMC 32 RS485/RS422 I/O using FMC, VHDCI-68 front panel connector |
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