16ch differential, 4x8bit DIO mezzanine card TFMC685
TEWS company ANSI/VITA 57.1 compliant FPGA mezzanine card (FMC) TFMC685.
The TFMC685 provides the capability to add a 16-bit M-LVDS (Multi-Point Low Voltage Differential Signaling) I/O interface or a 16-bit RS-485/RS-422 I/O interface to an FMC carrier card. TFMC685-10R: 16 M-LVDS I/O, 32 digital I/O, LPC-FMC TFMC685-20R: 16 RS485/RS422 I/O, 32 digital I/O, LPC-FMC Each I/O signal is connected to the VHDCI-68 connector on the front panel.
basic information
■Specifications ・Form Factor: Single-width 10 mm stacking height FPGA Mezzanine Card (FMC) module ・Signal Voltage (VADJ): 1.2V to 3.6V; Nominal Voltage 1.8V ・M-LVDS Driver/Receiver: SN65MLVD206 (Texas Instruments) or compatible ・RS-485/RS-422 Transceiver: THVD1450 (Texas Instruments) or compatible ・Digital I/O Bus Transceiver: SN74LXC8T245 (Texas Instruments) or compatible ・EEPROM: M24C02 (STMicroelectronics) or compatible ・Maximum Data Rate: 200Mbit/s per channel (M-LVDS), 50Mbit/s per channel (RS-485/RS-422) ・I/O Connector: Front I/O VHDCI68 / SCSI-V (Honda HDRA-EC68LFDT-SL+ or compatible) ・Operating Temperature Range: -40°C to +85°C
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Model number/Brand name
TFMC685 - TEWS Technologies
Applications/Examples of results
It is used in industrial equipment, testing devices, measuring instruments, and embedded devices.
Line up（2）
| Model number | overview |
|---|---|
| TFMC685-10R | 16 M-LVDS I/O, 32 digital I/O, FMC for VHDCI-68 front panel connector |
| TFMC685-20R | 16 RS485/RS422 I/O, 32 digital I/O, FMC for VHDCI-68 front panel connector |
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