Announcement of the "2024 Joint Seminar on Packaging Testing Technology" hosted by Shin-ei Technology.

nac Image Technology

We are pleased to announce that we will be hosting a seminar on packaging testing technology, organized by Shin-ei Technology Co., Ltd. To optimize packaging design, various tests and measurements are necessary, including quantifying the transportation environment, assessing product impact durability, selecting cushioning materials, structural design, and conducting packaging cargo tests. In this seminar, four related companies will come together to provide specialized techniques to support appropriate packaging design from the following perspectives: - Concepts of appropriate packaging design and specific examples of product durability testing - Simulation analysis techniques in the design process - High-speed image analysis to support packaging cargo testing - Latest trends in transportation vibration testing This seminar will be conducted as a web seminar using Zoom. Live presentations will be broadcast on September 18 (Wednesday), with recorded videos rebroadcast on September 25 (Wednesday) and October 8 (Tuesday). After registration, you will automatically receive a confirmation email containing the participation URL. *Please note that participation from competing companies may be declined.

Date and time Wednesday, Sep 18, 2024 ～ Tuesday, Oct 08, 2024
September 18, 2024 (Wednesday) - 14:00 to 16:00 (Live Broadcast) / September 25, 2024 (Wednesday) - 14:00 to 16:00 (Rebroadcast) / October 8, 2024 (Tuesday) - 14:00 to 16:00 (Rebroadcast)
Capital
Entry fee Free

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