It is possible to form a ceramic film on complex structures such as three-dimensional structures and hollow shapes!
【New Technology】Ceramic Dip Coating!! It enables the formation of ceramic films on complex structures such as 3D structures and hollow shapes.
In electronic components, it can be said that there is almost always a "sintering" process involved. Therefore, we would like to introduce a ceramic coating method using a dipping technique that differs from conventional thermal spraying for the setters you are using. 【Four Features】 ◆ High freedom of shape, capable of coating 3D shapes on a meter scale ◆ Coating possible on most high-performance materials ◆ Average thickness of 50μm achievable ◆ Good surface roughness of the coating with excellent smoothness (Ra 0.8 or lower) 【Materials that can be coated】 *Main setter materials ■ Mullite ■ Alumina-based ■ Zirconia-based ■ SiC-based *Both porous and dense materials can be accommodated. For coatings related to setters, many customers are selecting "zirconia films," so if you are having trouble choosing a film type, please try zirconia films first! Additionally, we currently have a lineup of dense grades of zirconia films, and by downloading, you can view SEM image data categorized by grade. In addition to zirconia, many other combinations of film types are possible, so please feel free to contact us.
basic information
(We have listed frequently asked questions) Q: Regarding the quantity of support A: We can accommodate from prototype to mass production. Q: I don't know how to select the type of film A: We will propose the optimal type of film based on the electronic components in question and the setter material. Q: What if I want to develop an original recipe? A: We can accommodate that. Q: Is it possible to request from the procurement of the base material? A: It is possible, but it may be cheaper if you provide the materials. ■ Please feel free to ask any other questions. (Method of film formation) 1. Generate the ceramic slurry you want to film. 2. Dip the workpiece into the tank containing the slurry. 3. Dry and bake to cure. Since baking is required, the heat resistance of the base material is also a key point. ■ Depending on the usage environment, baking may not be necessary. With our unique dipping technology, we offer high flexibility in shape and adhesion, allowing discussions on various themes beyond thick films. ■ We also have sample products and various data available. We are always available for meetings in person or via web meetings, so please feel free to contact us.
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Narasaki Industries offers a one-stop service from material selection to completion and processed products. We are currently providing a comprehensive catalog of high-performance materials. For more details, please download the PDF and take a look.
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