ナラサキ産業 メカトロソリューション部 機能材料課 Official site

Case study collection available! "Laser Microjet = Water Laser Processing"

I want to cut and drill difficult-to-machine materials such as ceramics and high melting point metals using laser processing that minimizes thermal effects!

◢Overview◤ The "Laser Microjet" is a processing technology that guides a laser to the material using a water jet with a minimum diameter of 30μm, while performing processing with cooling. This technology minimizes thermal effects from the laser to the extreme, ensuring that phenomena such as burn marks due to material melting do not occur, resulting in high-quality finished surfaces. With this innovative processing technology, high-precision and high-aspect-ratio cutting, hole drilling, and groove processing of materials such as metals and ceramics can be achieved. You can also check the details from the external link below. https://denki.narasaki.co.jp/laser-microjet ◢Target Materials◤ - Ceramics (alumina, aluminum nitride, silicon carbide, etc.) - Silicon - Metals (copper, aluminum, SUS, alloys, etc.) - Diamond, etc. ◢Processing Contents◤ - Holes - Grooves - Cutouts - Shape processing, etc. *Laser Microjet is a trademark of the processing technology developed by SYNOVA. We offer contract processing services from prototyping to mass production, so please feel free to contact us.

Narasaki Sangyo Co., Ltd. Water Laser Special Page

basic information

1. Contract Processing If you provide us with processing drawings, conceptual drawings, etc., we can accommodate contract processing. - Additional processing with supplied materials - Shape processing such as wafer downsizing - Test processing for verifying processing finish Please feel free to let us know your requests. *We can also prepare processing materials for you. 2. Laser Processing Machine Sales We also sell processing equipment. *For more details, please refer to the catalog.

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Applications/Examples of results

- Ceramics For example, ultra-hard materials that are difficult to machine, such as SiC, can be shaped and processed using laser microjet technology. - Silicon Downsizing from 12-inch wafers to 8-inch wafers is possible, and notches and orifices can be processed according to customer specifications. - Metal Processing High-quality finished surfaces can be achieved regardless of the material. This includes improving the quality of machined surfaces, processing complex shapes, and drilling operations.

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