We support the medical field from behind the scenes.
![[Objective] Metal and painted surfaces](https://image.mono.ipros.com/public/premium/image_category/809/116404/IPROS95685464247769075665.jpeg?w=140&h=140){kind=small}
![[Objective] Printing-related materials](https://image.mono.ipros.com/public/premium/image_category/809/116404/IPROS83062760853297000247.png?w=140&h=140){kind=small}
![[Usage] Automotive products](https://image.mono.ipros.com/public/premium/image_category/809/116404/IPROS99547085654519722447.png?w=140&h=140){kind=small}
Print is possible on surfaces with unevenness! Also used for catheters, examination kits, and more.
In the medical field, a variety of medical devices are truly being used. Among them, products utilizing Navitas printing machines are making a significant impact. In particular, pad printing machines are suitable for printing fine text and logos on small areas. They can also print on uneven surfaces, making them useful for syringes, catheters, and testing kits. Additionally, to ensure clean printing, corona treatment machines and plasma treatment machines are also used as surface treatments. Although it may not be apparent, we would be happy if we could contribute a little to the medical field. *For more details on the column, you can view it through the related links. Please feel free to contact us for more information.*
basic information
*You can view the detailed content of the column through the related link. For more information, please feel free to contact us.*
Price range
Delivery Time
Applications/Examples of results
The detailed content of the column can be viewed through the related links. For more information, please feel free to contact us.
Detailed information
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▶Fully Automated, Intelligent Integrated Solution A highly integrated fully automated test system that fully covers the complex chip inspection process.
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▶ Loading Module This module consists of the following four sub-functional modules: - Chimple Z-axis Module - X/Y-axis Movement Module - Blue Film Rotation Module - Pickup Function Unit This automates a series of processes for high-precision adsorption and transfer of chips on a wafer or an extension ring.
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▶High Temperature and Normal Temperature Test Module This module is a high-precision test unit compatible with two temperature ranges, consisting of the following components: - Hollow-type rotating platform (supports wafer flipping and transport switching) - Two 3-axis chip alignment modules positioned at the front and back - 3-axis optical detection module (PD and collimator optical system) - ID and position recognition camera installed on the top - Power-on Probe module: Executes position and angle correction after transport, allowing for accurate power-on and measurement of the chip The PD (photodiode) and collimator can be switched at high speed using independent drive axes, supporting automatic switching of functions according to the measurement mode.
