Sanko Giken Co., Ltd.
Punching processing technology for semiconductor, AI DC, and automotive devices.
We are a manufacturer based in Higashi-Osaka, celebrating 50 years in business, specializing in precision punching processing of substrates and electronic devices. Our representative product is responsible for all 100 million nationwide transportation IC cards, with zero market complaints, possessing the technology of "zero out of 100 million." In recent years, we have been mass-producing 3 million heat dissipation components per month for power semiconductors, while also engaging in new technology development through five selections for the subsidy program. We will introduce our processing and construction techniques, which received great acclaim at last year's Silicon Valley exhibition.
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