Gap filler Tflex SF800 series
Laird's silicone-free gap filler
Achieves a high thermal conductivity of 7.8 W/mK without silicon.
basic information
Thermal conductivity (W/mK): 7.8 Hardness (Shore 00): 81 Density (g/cc): 3.21 Thickness (mm): 0.5 to 4.0 Temperature range: -25°C to 120°C
Price range
Delivery Time
Applications/Examples of results
- Automobile - Flat panel display - Hard disk drive - Medical equipment - Laser equipment - Aerospace and defense - Solar energy
Distributors
Nihon Mic Corporation, established in 1974, is a trading company dealing in electronic components and mechanical parts. We have built trusting relationships with clients in various countries around the world, including the United States, the United Kingdom, Singapore, Taiwan, China, Hong Kong, Israel, and India, and have established a system to meet the needs of customers requiring overseas information and products. Please feel free to consult us when you have any requests.