Heat sink bonding sheet "Heat Magic"
Ideal for mounting semiconductors such as ICs and LSIs with heat sinks.
It is a sheet that can securely attach a heat sink and enable efficient heat conduction just by sticking it on.
basic information
■Just peel off the protective film like double-sided tape and stick it on ■Ideal for mounting semiconductors such as ICs and LSIs to heat sinks ■RoHS compliant (HM-1R, HM-3, HM-4) ■Base material: Aluminum (HM-1, HM-1R) ■Thickness: 0.1524mm (HM-1, HM-1R) ■Thermal resistance: 0.535℃in²/w 3.4℃cm²/w (HM-1, HM-1R) ■□■Product Lineup■□■ ■HM-1 ■HM-1R ■HM-3 ・Base material: Expanded aluminum ・Thickness: 0.23mm ・Thermal resistance: 1.7℃cm²/w ■HM-4 ・Base material: Kapton (Polyimide) ・Thickness: 0.13mm ・Thermal resistance: 3.7℃cm²/w
Price information
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Delivery Time
Model number/Brand name
Heat Magic (TM) Type HM
Applications/Examples of results
Heat sink
