We will be exhibiting at "Nepcon Japan 2013"!
日精 本社
Nippon Seiki Co., Ltd. will exhibit at the "Nepcon Japan 2013 Semiconductor Packaging Technology Exhibition" held from January 16 (Wednesday) to 18 (Friday), 2013. For details, please refer to the attached exhibition information materials. Location: Tokyo Big Sight [Booth Number] East 28-14
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What we pursue is a highly sensitive corporate image that quickly captures customer needs while responding with solid technical capabilities. Nissei utilizes its unique technological and marketing strengths to think about responding to a wide range of areas. Deeper and broader.