We will be exhibiting at "Nepcon Japan 2013"!
日精 本社
Nippon Seiki Co., Ltd. will exhibit at the "NEPCON Japan 2013 Semiconductor Packaging Technology Exhibition" held from January 16 (Wednesday) to 18 (Friday), 2013. For details, please refer to the attached exhibition information materials. Location: Tokyo Big Sight [Booth Number] East 28-14
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What we pursue is a highly sensitive corporate image that quickly captures customer needs while responding with reliable technical capabilities. Nissei utilizes its unique technical and marketing strengths that have been cultivated over time to think about responding to a wide range of areas. Deeper and broader.