Taiwan-made semi-automatic/fully automatic cutting and flattening processing machine
We will flatten metals and polymers with high precision.
- Capable of cutting materials using both "with water" and "without water" methods. - Can be operated immediately without the need for warm-up. - Our equipment has a high capacity for material size selection, accommodating up to 24 inches. - Can handle different sizes of materials in a single operation.
basic information
- Thickness variation control (TTV) < 3um - Surface roughness (Ra) < 30nm - Processable materials: gold, silver, tin, copper, polymers, etc. - Non-processable materials: diamond, sapphire ceramic, and other hard and brittle materials.
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Applications/Examples of results
Application examples - LED chip - LED package - Micro LED - UV LED - IR sensor - VCSEL - RDL (probe card technology) - Semiconductor bump trimming - Semiconductor substrate trimming - Ceramic substrate - Processing of ceramics and dissimilar materials - Ceramic roughness control - Ceramic coplanarity
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Nissei Sangyo Co., Ltd. was established in 1947 and is headquartered in Chuo-ku, Tokyo. Since its founding, the company has developed its business as a wide-ranging specialty trading company based on chemical products. It handles a wide variety of products, from those that support daily life and industry to high-tech products, as well as insurance and real estate.