Release sheet "Riva Alpha"
A sticky sheet that can be easily removed by heating. It’s a great product that can be firmly fixed but will peel off quickly when heat is applied! Perfect for improving the manufacturing efficiency of electronic components!
Nitto's thermal release sheet "Riva Alpha" has adhesive properties at room temperature and can be easily peeled off simply by heating, making it a unique adhesive sheet. It significantly contributes to automation and labor-saving in various manufacturing processes of electronic components. ■ What is thermal release? It was developed targeting a process where components and devices are firmly bonded during processing, and after heat treatment, the adhesive strength is lost, allowing for natural release. At room temperature, it adheres like a regular adhesive sheet. When you want to peel it off, simply heating it causes the adhesive layer to foam, reducing the adhesive area and allowing for natural release. ■ Mechanism of thermal release The thermal release adhesive layer contains capsules that expand when heat is applied. Therefore, when heat is applied, the capsules expand, creating a rough surface on the thermal release adhesive layer, which eliminates the adhesive strength and allows for natural peeling from the substrate.
basic information
■Features - At room temperature, it adheres like a regular adhesive sheet, and when you want to remove it, you can easily peel off the tape just by applying heat. - You can choose from various processing shapes such as sheets, rolls, and labels. - You can select the heating temperature for peeling. - Since it can be reliably peeled off at a constant temperature, it contributes to automation and labor-saving. - It does not damage the substrate when peeling off the tape. ■Benefits of Manufacturing Efficiency - Since the substrate can be securely fixed during processing, it prevents positional displacement and improves processing accuracy. - It can be used in long tape form, enabling continuous manufacturing processes. The ability to peel off instantly with heat greatly contributes to increased productivity. Additionally, it reduces the labor involved in peeling, promoting labor-saving. - When using wax or adhesives, a cleaning process is required to remove these with solvents after peeling, but Revalfa is a dry method that does not require a cleaning process. It minimizes contamination by impurities and external pollutants in a dry environment. - Natural peeling is possible without applying force, which prevents damage to the workpiece and contributes to improved yield. *For details such as product number selection, please feel free to contact us.
Price range
Delivery Time
Applications/Examples of results
● For temporary fixation during dicing of electronic components ● For temporary fixation to prevent misalignment ● For transfer applications of chip components Various temporary fixation, transfer, carriers, masking, protection, and coating processing, etc.
