Semiconductor manufacturing process TCB {Thermal Compression Bonding} release film "HR-S051"
Combining the thermal stability of PI and the release properties of PTFE! Suitable for preventing chip damage and contamination of bonding materials on press plates.
"HR-S051" is a release film that combines a polyimide film with a fluororesin (PTFE) layer. Due to its thinness, it has excellent thermal conductivity and can be used at high temperatures above 300°C. It possesses the thermal stability of PI and the release properties of PTFE, excelling in heat resistance, mechanical strength, dimensional stability, and release properties. 【Features】 ■ Combines the thermal stability (mechanical strength, dimensional stability) of polyimide with the release properties of PTFE ■ Excellent heat resistance, usable as a release film even at high temperatures of 300°C ■ Thin, providing excellent thermal conductivity *For more details, please refer to the PDF document or feel free to contact us.
basic information
【Characteristics】 ■Thickness [mm]: 0.03 ■Tensile Strength [MPa]: 205 ■Elongation [%]: 50 ■Surface Roughness (Rmax) [um]: 0.5～1 ■Thermal Conductivity [W/(m-k)]: 0.15 ■Dimensional Change Rate at 300℃ for 1 minute ・Length Direction (MD) [%]: -0.04 ・Width Direction (TD) [%]: -0.02 *For more details, please refer to the PDF document or feel free to contact us.
Price range
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Applications/Examples of results
【Purpose】 ■ For semiconductor TCB (thermal compression bonding) process release ■ Prevention of chip damage ■ Prevention of contamination of bonding materials on the press plate *For more details, please refer to the PDF document or feel free to contact us.
