"MPS" series release films for semiconductor manufacturing process molds.
It is difficult for adhesive substances to adhere, and they can easily release even upon contact!
The "MPS" series is a mold release fluoropolymer (PTFE) film that excels in heat resistance and release properties. It can be used continuously from -100°C to 260°C (recommended value), and can withstand even higher temperatures for short periods. There is a lineup of standard products, thermal expansion control products, and high strength/high thermal shrinkage products. 【Lineup】 ■MPS-10: Standard ■MPS-11: Low thermal expansion ■MPS-13: High strength/high thermal shrinkage *For more details, please refer to the PDF document or feel free to contact us.
basic information
【Characteristics (Partial)】 ＜MPS-10＞ ■Tensile Strength (MD/TD) [MPa]: 50/40 ■Elongation (MD/TD) [%]: 300/340 ＜MPS-11＞ ■Tensile Strength (MD/TD) [MPa]: 58/38 ■Elongation (MD/TD) [%]: 258/351 ＜MPS-13＞ ■Tensile Strength (MD/TD) [MPa]: 79/39 ■Elongation (MD/TD) [%]: 120/335 *For more details, please refer to the PDF document or feel free to contact us.
Price range
Delivery Time
Applications/Examples of results
【Usage】 ■ For mold release during resin encapsulation of semiconductor chips ■ Release from resin ■ Prevention of mold contamination by sealing resin ■ Solvent reduction * For more details, please refer to the PDF document or feel free to contact us.
