Fluorine-based substrate protection aerosol AegisCoat WOP
Spray can type fluorine-based substrate protective coating agent easily handles "moisture-proof, drip-proof, and rust-proof" for electronic substrates!
Aegis Coat WOP is a coating agent that protects electronic circuits with a highly adhesive and flexible fluoropolymer film. It has a powerful moisture-proof performance with a thin film of several micrometers, repelling water, oil, and chemicals. This excellent moisture resistance and strong adhesion to the substrate provide high rust prevention performance. It has already been adopted by many major electronics manufacturers as an industrial product. If you would like a detailed instruction manual, please contact us.
basic information
【Features】 Waterproof and rust-resistant: Exhibits high waterproof and rust resistance. Drying properties: Forms a strong fluorine film through room temperature drying. Adhesion: Demonstrates excellent adhesion and insulation on various substrates. Application workability: Can be applied using a dispenser, brush, dipping, or spray. Compliance with various environmental regulations: Not subject to RoHS, REACH, or PRTR, and is a PFOA countermeasure product. In response to the demand for "easy use for small production and testing," a spray can type has been introduced. It is currently available for purchase on Amazon. *For detailed information, please request it through the "Contact Us" section.
Price range
P1
Delivery Time
OTHER
Model number/Brand name
AegisCoat WOP
Applications/Examples of results
【Applications】 ■ Moisture and drip protection for mobile devices (such as mobile phones and digital cameras) ■ Moisture and drip protection for electronic devices mounted on automotive electronic boards ■ Drip and condensation protection for electronic boards of outdoor equipment (such as air conditioners) and water-related products ■ Chemical resistance protection against saltwater, electrolytes, and corrosive gases ■ Protection of battery control boards from electrolyte in LIBs ■ Prevention of migration of metal components and electrode parts on electronic boards *For detailed information, please request from "Contact Us."
